Cho bond 1121
WebParker Chomerics CHO BOND® 1121 is a one component, VOC-free, silver-plated copper filled sealant formulated to serve as gap filler for EMI shielding or electrical grounding. CHO BOND® 1121 is a gray-colored silicone that is ideally used for filling gaps but can also serve as a repair or bonding agent for elastomer gaskets where moderate ... Web• No VOCs version CHO-BOND 1121 • Easy-to-use, no weighing or mixing required • Excellent conductivity 0.01 ohm-cm • 30 min work life, rapid skin formation, 24 hr handling time, requires no pressure during curing, wide range …
Cho bond 1121
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WebCured CHO-BOND 1121 remains flexible and conductive at temperatures from -55°C to 125°C. Uncured CHO-BOND 1038 is a smooth, nonflowing paste that may be knife-spread or applied directly to a vertical surface. CHO-BOND 1121 forms a cured skin within two minutes after exposure to atmospheric moisture and therefore must be tooled within this ... WebCHO-BOND® 1121 has identical properties to CHO BOND® 1038 with the exception of VOC content and shelf life (1121 no VOCs and 12 month shelf life) Features and …
WebChomerics Division is part of the Parker Hannifin Corporation Engineered Materials Group, and is a global leader in the development and application of electrically conductive and … WebCHO-BOND 1016 CHO-BOND 1030 CHO-BOND 1035 CHO-BOND 1038 CHO-BOND 1075 CHO-BOND 1121 The above silicones and adhesives are still available for purchase without CHO-BOND 1086 primer. Specific part numbers are listed on page two of this document. Please contact your Parker Chomerics Inside Sales representative to update …
WebCHO-BOND® 1075 Ag/Al silicone 2.0 0.01 175/1207 NA 1 week* 30 mins. 6 1086 Sealing Enclosure Seams Primer promotes adhesion CHO-BOND® 1121 Ag/Cu silicone 3.6 0.01 … WebCHO-BOND® 1121 has identical properties to CHO BOND® 1038 with the exception of VOC content and shelf life (1121 no VOCs and 12 month shelf life) Features and Benefits: • One-component system so no mixing or measuring required • Excellent electrical conductivity levels (0.010 ohm-cm) • No corrosive by-products generated during drying ...
WebCho-Bond 1121. Sealant; 1-Part; Medium paste; Silicone; Moisture . A silver-plated copper filled, one-component conductive silicone. It is designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding grounding.
WebCHO-BOND 1038 called CHO-BOND 1121. For best adhesion results, CHO-BOND 1038 should be used in conjunction with CHO-SHIELD 1086 primer. Typical applications include man portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters. CHO-BOND® 1038 and 1121 ONE COMPONENT … hopon hopoff berlinWebCHO BOND® 1038 is a one component, silver-plated copper filled sealant formulated to serve as gap filler for EMI shielding or electrical grounding. CHO BOND® 1038 is a gray-colored silicone that is ideally used for filling gaps but can also serve as a repair or bonding agent for elastomer gaskets where moderate strength (150 PSI lap shear strength) is … long way down packetWebCHO-BOND® 1121 has identical properties to CHO BOND® 1038 with the exception of VOC content and shelf life (1121 no VOCs and 12 month shelf life) Features and Benefits: • One-component system so no mixing or measuring required • Excellent electrical conductivity levels (0.010 ohm-cm) hop on hop off barcelona red routeWebCHO-BOND® 1121 has identical properties to CHO BOND® 1038 with the exception of VOC content and shelf life (1121 no VOCs and 12 month shelf life) Features and … hop on hop off berlinoWebDescription for Parker Chomerics Cho-Bond 1121 A silver-plated copper filled, one-component conductive silicone. It is designed for use as a fillet, gap filler and seam … longwaydown.pdfWebParker Chomerics Technical Data Sheets. Cho-Bond 360 20 (Two component silver plated copper filled epoxy) Cho-Bond 1030 (One component, Ag plated Cu filled silicone RTV) … hop on hop off belfast northern irelandWebCHO-BOND 1121 is a silver-plated copper filled, one-component conductive silicone. It is designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding. Minimum recommended bond line for CHOBOND 1121 is 0.007 inches (0.18mm). long way down pictures